Home News DMG / Mori Seiki USA Announces Innovation Days

DMG / Mori Seiki USA Announces Innovation Days

Training/Tutorials, Turning/Milling, Industry News

DMG / Mori Seiki USA will host Innovation Days 2012 at their Chicago Solution Center on May 8 - 10 Chicago, IL.

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Manufacturing Group April 13, 2012

DMG / Mori Seiki USA has announced the annual Innovation Days event will take place at the company’s Headquarters and Chicago Solution Center on May 8 – 10, 2012 where progressive machine technology will combine with the latest tooling, automation, software, training and application strategies. Manufacturers will have the opportunity to experience everything needed to stay at the forefront of manufacturing - all in one place.

This once-yearly event gives machine tool users access to over thirty-five live milling, turning and multi-axis cutting demonstrations and dozens of engineers specializing in advanced machining solutions. Technical seminars at the 3-day event will be presented by industry experts and span several productivity-boosting topics including: Expanding Production, Shop Floor Networking & Communication, Manufacturing in America, New Solutions for Gear Milling, and Online Learning.

Other presentations will encompass a wide variety of topics, including technical and new product seminars. Cutting demonstrations will concentrate on the newest DMG / Mori Seiki equipment with process integration, automation and complex machining, as well as partner companies demonstrating tooling, software and accessories.

Also highlighted at Innovation Days 2012 will be innovative new products from DMG / Mori Seiki. Over a dozen U.S. premieres will take place, including the Milltap 700 and the LaserTec 20 PrecisionTool. The Milltap 700 represents Mori Seiki’s first corporate development with DMG. This vertical milling and boring center achieves productivity and efficiency that is supported by both high speed machining and rapid tool changing, all with a compact footprint. The LaserTec 20 PrecisionTool is a 5-axis precision machine with a pulsed fiber laser that can accomplish up to 3μm cutting edge radius without the necessity of further finishing

Showcased at the event will be the ever expanding X-Class Series of machines from Mori Seiki. The X-Class, which successfully debuted in the US at IMTS 2010, has quickly become in demand for its unprecedented levels of precision, quality and reliability at an affordable price with the flexibility to meet changing customer needs. Four NHX Series machines – including the NHX4000, NHX5000, NHX5500 and NHX6300 – will be demonstrated at Innovation Days and are especially notable because production on NHX series machines will begin in the US factory later this year.

Click here for a complete list of machine demonstrations, seminar information and to register to attend Innovation Days.

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